Monocrystalline Wafers
Application: Remove damage created in the sawing process, texturize the wafer surface and prepare the wafers for diffusion.
The process uses alkaline solutions for particle removal and texturization and an acid solution for ionic contamination removal.
Process
Purpose
Pre-clean
(recommended)
(recommended)
Use an alkaline pre-treatment solution to remove organic contamination and particles
from the wafer surface to improve texturization uniformity.
Heated KOH/IPA
multiple tanks required for throughput
multiple tanks required for throughput
Acidic solution eliminates damage (small cracks) from sawing process that if not
eliminated would reduce the amount of energy that is outputted from the cell.
HF/HCl
Final clean step removes metal impurities and oxide to maximize minority carrier
lifetime and sheet resistance to yield higher cell efficiency.
Saw Damage
Removal/Texturization
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image
Removal/Texturization
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image
Top View Drawing
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click for full-size image
For further information or to set up a teleconference with a NAURA Akrion process expert, please send an email request to marcom@akrionsystems.com