Application
NAURA Akrion PSG etch & clean application is used to remove the deposited phosphosilicate glass from the wafer to prepare it for AR nitride deposition.
Process
Purpose
HF
Acidic solution removes the deposited phosphosilicate glass (PSG) to prepare the
wafer for AR nitride deposition.
Alkaline Clean
(recommended)
(recommended)
Alkaline solution removes contaminates from the wafer surface that were added during
previous steps. These contaminants, if not removed, can affect the passivation of
the surface and the resultant quality of the aluminum paste that can be applied.
HF
(recommended)
(recommended)
Acidic solution removes the oxide grown on the wafers during the clean up step.
Prepares a clean surface before AR deposition.
Top View Drawing
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- Multicrystalline – Saw Damage Texturization and Clean
- Monocrystalline – Saw Damage Texturization and Clean
- Advanced Applications
For further information or to set up a teleconference with a NAURA Akrion process expert, please send an email request to marcom@akrionsystems.com